6th European Conference on Silicon Carbide and Related Materials, ECSCRM 2006, Newcastle upon Tyne, UK, September 3rd - 7th, 2006


ECSCRM 2006


Newcastle upon Tyne,  UK


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 ECSCRM 2006 Invited Presentations (Complete)


 Plenary Lectures:

Peter Friedrichs

 

 SiCED, Germany

 

 SiC power devices: present and future.

Nick Wright   University of Newcastle, United Kingdom    SiC Electronics – an historical overview.

 Invited Oral Presentations:

John Steeds

 

 University of Bristol, United Kingdom

 

 Photoluminescence investigation of defects created by electron bombardment of 4H-SiC.

Gerhard Pensl    University of Erlangen-Nurnberg, Germany  

 (Nitrogen/vacancy)-complex formation in SiC: experiment and theory.

         
Michael Uren    QinetiQ, United Kingdom    Advances in GaN/SiC electronic devices.
Cem Basceri      Cree Dulles, USA  

 Status of commercial scale 3-inch and 100mm diameter micropipe-free SiC substrate production.

Anant Agarwal    Cree, Inc., USA    A case for high temperature SiC bipolar devices.
Tsunenobu Kimoto    Kyoto University, Japan  

 Growth and electrical characterization of SiC epi-layers.

Roberta Nipoti    CNR-IMM, Italy  

 Relevance of the heating rate during the post implantation annealing of 4H-SiC.

Adam Gali    Budapest University of Technology and Economics, Hungary  

 Point defects and their aggregates in silicon carbide.

Anne Henry    Linköping University, Sweden    Growth of thick epitaxial layers for power devices.
Einar Sveinbjörnsson    Chalmers University, Sweden    The SiO2/4H-SiC interface.
Brett Hull   Cree, Inc., USA  

Progress on the Development of 10 kV 4H-SiC PiN Diodes for High Current/High Voltage Power Handling Applications.

Gerald Soelkner    Infineon Technologies, Germany  

Reliability of SiC power devices against cosmic radiation-induced failure.

Leon Tolbert    The University of Tennessee, USA  

SiC-based Power Converters for High Temperature Applications.

Thomas Straubinger    SiCrystal AG, Germany  

Quality Aspects for the Production of SiC Bulk Crystals.

 


 Invited Poster Presentations:

Poster session 1

Gabriel Ferro   LMI - University Lyon 1, France  

Growth of SiC from a liquid phase at low temperature.

Alton Horsfall    University of Newcastle, United Kingdom  

 Trap Assisted Gas Sensing Mechanism in SiC Capacitors.

Alexander Lebedev    Ioffe Institute, Russia  

 SiC heteropolytype structures grown by sublimation epitaxy.

Poster session 2

Toshiharu Ohnuma   CRIEPI, Japan  

Dynamical simulation of SiO2/4H-SiC(0001) interface oxidation process: from first-principles.

 Patrick Soukiassian

  Commissariat ā l'Energie Atomique, France  

Atomic Cracks Defects Developing at Silicon Carbide Surfaces.

Kevin Kirchner   Army Research Lab, USA  

Mosaicity and Wafer Bending in SiC Wafers as Measured by Double and Triple Crystal X-Ray Rocking Curve and Peak Position Maps.

Poster session 3

Thomas Frank   University of Erlangen-Nuernberg, Germany  

Control of the flatband voltage of 4H-SiC Metal-Oxide Semiconductor (MOS) capacitors by co-implantation of nitrogen and aluminum.

Carey Tanner    UCLA, USA  

Experimental and First-Principles Studies of the Band Alignment at High-k Oxide / SiC Interfaces.

Wolfgang Bartsch    SiCED Electronics Development GmbH & Co. KG, Germany  

Bipolar SiC-diodes - Challenges arising from Physical and Technological Aspects.